Lead-free Silver-containing Solder Paste, Strong Conductive Sn96.5Ag3.0Cu0.5 Solder Paste, Melting Point: 217°C
Discover premium lead-free solder paste with Sn96.5Ag3.0Cu0.5 composition, strong conductivity, and 217°C melting point. Ideal for SMT applications in electronics manufacturing.
Key points
- Lead-free and environmentally safe formulation
- High electrical conductivity for optimal performance
- Precise Sn96.5Ag3.0Cu0.5 alloy composition
- Melting point of 217°C ensures reliable reflow results
- Excellent wetting and joint strength for durable connections View product presentation
Color: Sn96.5Ag3.0Cu0.5
Weight: 50g
France
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Product presentation
Engineered for Precision: Premium Lead-Free Solder Paste for Reliable Electronic Connections
This high-performance lead-free solder paste is formulated with a precise alloy composition of Sn96.5Ag3.0Cu0.5, ensuring excellent electrical conductivity and reliable solder joints for advanced electronic assemblies. Designed for use in surface mount technology (SMT), this solder paste offers superior wetting properties, consistent flux activity, and minimal voiding during reflow. With a melting point of 217°C, it is ideal for applications requiring precision and durability. The inclusion of silver enhances strength and thermal stability, making it suitable for demanding industrial, automotive, and consumer electronics manufacturing environments. Its natural formulation avoids harmful substances, supporting environmentally responsible production practices.
| Brand Name KEK |
| High-concerned chemical None |
| Origin Mainland China |
| Model Number Sn96.5Ag3.0Cu0.5 |
| Certification RoHS |
| Particle Size 20-38μm |
